An Empirical Study on Convective Drying of Ginger Rhizomes Leveraging Environmental Stress Chambers and Linear Heat Conduction Methodology

This comprehensive study provides an in-depth examination of the convective drying process and drying kinetics of ginger rhizomes (Zingiber officinale), precisely honing in on the influence of moisture content variation on the thermal property of thermal conductivity. Our research reveals a direct correlation between decreasing moisture content and thermal conductivity during dry-ing, conducted under meticulously controlled conditions with a drying temperature range of 10℃ to 60℃ and an optimum drying temperature identified at 60℃ with a relative humidity of 35%. We scrutinise the thermal properties, namely the thermal conductivity, in relation to moisture content, shedding light on the intricate dynamics involved. The study uncovers the distinct ad-vantage of convective drying over traditional methods, shortening the drying time to just 24 hours, compared to the nine and eight days required for open sun and solar tunnel drying. We identified optimal moisture levels for various ginger types: unblanched (6.63%, thermal conduc-tivity 0.0553W/m.K), blanched (9.04%, thermal conductivity 0.0516W/m.K), peeled (8.56%, ther-mal conductivity 0.0483W/m.K), and unpeeled ginger (5.98%, thermal conductivity 0.0460W/m.K). As drying progressed, the moisture content fell from 81% to approximately 6-9%, concomitantly lowering the thermal conductivity from roughly 0.0553W/m.K to around 0.0460-0.0516W/m.K. These findings offer significant implications for the food industry, propos-ing improvements in drying processes and strategies for energy conservation when drying ginger rhizomes and similar agricultural produce. Moreover, this study sets a solid foundation for fu-ture investigations into potential applications of these insights to other agricultural products and various drying techniques

Characterising Solder Materials from Random Vibration Response of their Interconnects in BGA Packaging

Solder interconnection in electronic packaging is the weakest link, thus driving the reliability of electronic modules and systems. Improving interconnection integrity in safety-critical applications is vital in enhancing application reliability. This investigation qualifies the random vibration response of five essential solder compositions in ball grid array (BGA) solder joints used in safety-critical applications. The solder compositions are eutectic Sn63Pb37 and SnAgCu (SAC) 305, 387, 396, and 405. Computer-aided engineering (CAE) employing ANSYS FEA and SolidWorks software is implemented in this investigation. The solder Sn63Pb37 deformed least at 0.43 µm, followed by SAC396 at 0.58 µm, while SAC405 deformed highest at 0.88 µm. Further analysis demonstrates that possession of higher elastic modulus and mass density culminates in lower solder joint deformation. Stress is concentrated at the periphery of the solder joints in contact with the printed circuit board (PCB). The SAC396 solder accumulates the lowest stress of 14.1 MPa, followed by SAC405 at 17.9 MPa, while eutectic Sn63Pb37 accrues the highest at 34.6 MPa. Similarly, strain concentration is found at the interface between the solder joint and copper pad on PCB. SAC405 acquires the lowest elastic strain magnitude of 0.0011 mm/mm, while SAC305 records the highest strain of 0.002 mm/mm. These results demonstrate that SAC405 solder has maximum and SAC387 solder has minimum fatigue lives